Huawei unveiled the Mate XT2, its latest tri-fold smartphone, while Xiaomi introduced the Xiaomi 18 Fold on September 7. Huawei is continuing with a two-hinge design intended to expand a smartphone into a substantially larger display, whereas Xiaomi has chosen a conventional book-style foldable architecture.

The launches add another layer to competition in China’s premium smartphone market, where manufacturers are using increasingly differentiated hardware and internally developed technologies to compete for high-end consumers.

Huawei Extends Its Tri-Fold Architecture

Huawei’s Mate XT2 builds on the company’s existing tri-fold approach, using two folding mechanisms to expand the device into a larger-screen format.

The previous Mate XT featured a fully opened display measuring 10.2 inches diagonally. Huawei’s new generation retains the basic architecture while introducing updated hardware and structural changes.

The Mate XT2 is powered by Huawei’s Kirin 9050 Pro processor and uses a LogicFolding architecture that the company says is designed to improve performance and efficiency. Huawei has also emphasized durability and privacy features as part of its effort to develop the more complex folding format for everyday use.

Launch information places the Mate XT2 at 19,999 yuan for the entry configuration, rising to 24,999 yuan for the highest configuration. Sales are scheduled to begin September 12.

The pricing puts the device firmly into the luxury segment and distinguishes Huawei’s tri-fold strategy from more conventionally priced premium smartphones.

Xiaomi Chooses the Book-Style Foldable

Xiaomi is taking a different route with the Xiaomi 18 Fold, which opens from a phone-sized exterior into a larger internal display.

The company has positioned the model as a premium flagship and highlighted its internally developed XRING O3 processor. Xiaomi’s official launch material describes the 18 Fold as its first flagship smartphone powered by the next-generation chip.

The device also features a Leica-branded camera system, extending Xiaomi’s use of imaging technology as a component of its premium smartphone strategy.

Pricing starts at 10,999 yuan and reaches 14,999 yuan for the highest configuration. That makes the Xiaomi considerably less expensive than Huawei’s Mate XT2, although both remain positioned above conventional flagship smartphones.

The difference in architecture and pricing gives the companies distinct propositions within the same premium foldable market.

Proprietary Technology Becomes Part of the Competition

The launches highlight a broader shift in how China’s leading smartphone manufacturers are approaching flagship hardware.

Huawei has developed alternatives to technologies and components affected by U.S. restrictions, while Xiaomi has invested in proprietary semiconductor technology of its own. As a result, processors and other internally developed technologies increasingly form part of broader product strategies rather than serving simply as individual hardware components.

That approach can give manufacturers greater control over product development while reducing dependence on external suppliers. It also makes the smartphone itself a showcase for capabilities spanning semiconductors, software, displays, imaging and artificial intelligence.

The two foldables therefore represent more than competing form factors. They also illustrate how Chinese smartphone companies are integrating internally developed technologies into high-end consumer devices.

Foldable Design Becomes a Premium Differentiator

Foldable smartphones remain a smaller segment of the overall mobile-phone market, but the category has become an important area for differentiation among manufacturers competing at the premium end.

The underlying proposition is to provide a substantially larger display without requiring users to carry a conventional tablet-sized device. For manufacturers, folding hardware also creates opportunities to distinguish flagship products as conventional smartphone designs become increasingly mature.

Huawei’s continued investment in a tri-fold configuration indicates an effort to move beyond the two-panel designs more commonly associated with foldable phones.

Xiaomi’s 18 Fold takes a less complicated structural approach while competing through other premium technologies, including its processor platform and Leica-branded imaging system.

A Wide Price Gap Reflects Different Strategies

The two launches also demonstrate how differently manufacturers are positioning foldable technology.

Huawei’s Mate XT2 starts at nearly 20,000 yuan, while Xiaomi’s 18 Fold begins at 10,999 yuan. The gap gives Xiaomi a lower-priced entry point into the premium foldable segment, while Huawei is positioning its tri-fold architecture as a significantly more expensive technology proposition.

A central question for Huawei’s approach is whether consumers will consider the additional folding section and resulting display flexibility worth the substantial price premium.

The answer will depend on practical factors including durability, software support, battery life and everyday usability, as well as the perceived value of the larger display.

Competition Extends Beyond China’s Domestic Market

The launches come during a busy period for the global smartphone industry. Apple is expected to unveil new products on September 9, immediately following the Huawei and Xiaomi announcements.

For Chinese manufacturers, competition therefore extends beyond the domestic market and includes global companies with established brands and large technology ecosystems.

The increasingly differentiated hardware strategies of Huawei and Xiaomi are part of that wider competition. Their latest foldables show how premium smartphone manufacturers can pursue different combinations of industrial design, semiconductor development, imaging and display technology.

Domestic Semiconductor Development Gains Importance

The Xiaomi 18 Fold’s use of the XRING O3 also highlights the growing role of domestic semiconductor development in China’s consumer electronics sector.

Xiaomi’s investment in its own processor technology gives the company another internally controlled component for its flagship devices. Huawei, meanwhile, continues developing proprietary hardware technologies while operating under restrictions that affect its access to some advanced foreign components.

The implications extend beyond smartphones. Greater reliance on domestically developed processors and other technologies connects consumer electronics competition with China’s broader development of semiconductor, artificial-intelligence and advanced manufacturing capabilities.

For the smartphone industry, the result is a competitive environment in which the architecture of the device and the technologies inside it are increasingly linked to wider corporate technology strategies.

Two Paths for the Next Foldable Generation

Huawei and Xiaomi are entering the latest phase of the Chinese foldable market with markedly different designs.

Huawei is using a tri-fold architecture to pursue a larger display within a smartphone-oriented form factor. Xiaomi is retaining the more established book-style configuration while emphasizing its own processor technology and premium imaging system.

Their launches leave consumers with two different approaches to high-end foldable hardware—and manufacturers with a continuing test of how much complexity, cost and proprietary technology the market is willing to support.

For China’s smartphone industry, the significance extends beyond the two devices. The launches show that competition at the premium end is increasingly being fought through proprietary semiconductor technology, industrial design and integrated hardware ecosystems as well as conventional smartphone specifications.

Reporting Credit: Huawei — official Mate XT2 product and launch information; Xiaomi — official September 7, 2026 announcement for the Xiaomi 18 Fold and XRING O3 platform; Xiaomi Community — official Xiaomi 18 Fold product information, including the Leica camera configuration; Huawei and Xiaomi — official corporate and product materials concerning their respective proprietary technologies.

The post Huawei and Xiaomi Escalate China’s Foldable Smartphone Technology Race appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

As Windows 10 reaches its official end of life, Microsoft’s shift to Windows 11 has left many PC users facing tough upgrade decisions. Systems powered by Intel’s 7th-generation Core processors and older, as well as early AMD Ryzen models, can no longer receive updates — raising concerns about long-term security and performance.

Windows 10 Reaches End of Life

Microsoft officially ended mainstream support for Windows 10, marking a major transition for hundreds of millions of devices worldwide. Without regular updates or security patches, any PC still running Windows 10 is now vulnerable to security threats and software incompatibilities.

While short-term protection can be maintained with strong antivirus and anti-malware programs, experts warn that relying on outdated operating systems increases the risk of cyberattacks, malware infections, and performance issues over time.

Windows 11’s Stricter Hardware Requirements

When Microsoft launched Windows 11, it introduced tougher hardware requirements than any previous version of the operating system. These were designed to improve system security and overall stability.

The most notable requirements include:

• TPM 2.0 (Trusted Platform Module) support for enhanced encryption

• Secure Boot compatibility for verified system startup

• Modern processor architecture with built-in hardware mitigations against exploits

However, these changes have effectively excluded millions of older computers — particularly those using CPUs released before 2018.

Intel’s 7th-Generation Processors No Longer Eligible

According to Microsoft’s compatibility list, Windows 11 officially supports only Intel’s 8th-generation Core series (and newer). This includes all i3, i5, i7, and i9 chips released from 2017 onward, as well as newer Xeon and Core Ultra processors.

That means most systems using Intel’s 6th- or 7th-generation chips — such as the popular Core i5-7600K or i7-7700K — are not eligible for Windows 11 updates. The only exception is the Core i7-7820HQ, found in select laptops that shipped with updated driver frameworks.

The decision stems from the fact that earlier processors lack key architectural features necessary for Windows 11’s security goals, such as advanced virtualization and hardware-based isolation.

AMD Ryzen 1000 Series Also Left Behind

The situation is similar for AMD users. Microsoft’s baseline support begins with the Ryzen 2000 series and newer. This excludes the first-generation Ryzen 1000 lineup, along with older FX and A-series CPUs.

Some early Ryzen Mobile processors also fall outside official support, meaning many laptops built before mid-2018 cannot run Windows 11 without workarounds.

For buyers considering secondhand or refurbished PCs, checking the processor model is essential. Systems built before 2018 are unlikely to qualify for official updates, no matter how powerful they may seem in benchmarks.

Manual Installation: A Risky Workaround

Although it is technically possible to install Windows 11 on unsupported systems, Microsoft discourages the practice. Users who bypass hardware checks through manual installation or registry edits can run the operating system, but they forfeit access to official updates and security patches.

That approach leaves devices more vulnerable to cyber threats and system instability. Microsoft has also warned that future updates may block unsupported installations entirely.

Experts advise against investing in machines that require such workarounds, especially for business or long-term use.

Security and Longevity Over Raw Performance

The main reason for Microsoft’s stricter requirements lies in security modernization. Windows 11’s foundation depends on trusted hardware components like TPM 2.0 and Secure Boot to protect user data and prevent firmware-level attacks.

Older chips lack hardware-based safeguards such as memory integrity enforcement and virtualization-based security, which are now standard in modern CPUs.

By phasing out older hardware, Microsoft aims to ensure that Windows systems are not only faster but inherently more secure and resilient against sophisticated cyberattacks.

What Consumers Should Do Next

For users still running older systems, there are several options:

1. Upgrade the hardware: Purchasing a PC with at least an 8th-generation Intel Core or Ryzen 2000 series processor ensures long-term support.

2. Stay on Windows 10 temporarily: Continue using Windows 10 with reliable antivirus protection, but understand that updates will no longer arrive.

3. Consider alternatives: Lightweight Linux distributions can extend the lifespan of older PCs while maintaining basic security and compatibility.

Retailers and tech experts caution consumers to double-check processor models before buying used or refurbished computers. Microsoft maintains a full list of supported processors on its website, which buyers can consult before making any purchase decisions.

The Future of PC Compatibility

As Microsoft continues to focus on hardware-backed security, the gap between old and new systems will likely widen. The company has signaled that future versions of Windows will depend even more on AI-enabled processors, onboard neural processing units (NPUs), and other advanced silicon features.

For users still running pre-2018 hardware, this means that Windows 11 — and its successors — may remain out of reach unless significant upgrades are made.

While the transition may be inconvenient, experts argue that it represents a necessary evolution in cybersecurity and reliability. Modern systems, they note, are not just about faster performance but about defending against an increasingly complex digital threat landscape.

Source: TechRadar – From today, there’s one more reason why you shouldn’t buy a PC running Intel 7th generation Core processors and older

The post Why PCs With Intel 7th-Gen and Older Chips No Longer Support Windows 11 appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

Published Time: 09-18-2025, 14:30 EDT

Nvidia, the world’s most valuable semiconductor company, announced Thursday that it will invest $5 billion in Intel and partner with the struggling chipmaker to develop artificial intelligence (AI) infrastructure and new personal computing technologies. The move underscores how Nvidia is seeking to expand its ecosystem while Intel, once a Silicon Valley leader, works to regain its footing in a rapidly evolving industry.

Nvidia and Intel Join Forces on AI Data Centers

In a joint press release, Nvidia confirmed that the partnership will focus on building custom data centers designed to support the growing demands of AI-driven applications. These facilities will serve as critical infrastructure for training and deploying large-scale AI models.

Intel will leverage its longstanding expertise in processors, while Nvidia contributes its market-leading GPUs and AI technologies. Together, the companies aim to design scalable, energy-efficient systems that can power next-generation AI services for industries ranging from healthcare and finance to cloud computing.

Industry analysts say the collaboration could reshape the competitive landscape of AI infrastructure. By combining resources, Nvidia and Intel could challenge other semiconductor leaders seeking to dominate the data center market.

$5 Billion Investment Boosts Intel’s Prospects

As part of the agreement, Nvidia will acquire $5 billion worth of Intel common stock, pending regulatory approval. The investment provides Intel with fresh capital and signals confidence in its long-term strategy, even as the company has struggled to keep pace with industry shifts.

Intel’s stock responded positively to the announcement, surging 30% in premarket trading, according to financial reports. Market experts suggest that Nvidia’s backing could restore investor confidence in Intel’s ability to innovate after years of declining market share.

Intel’s Struggles and Path to Revival

Intel, once synonymous with personal computing, was a driving force in Silicon Valley during the PC boom. However, the company faltered after missing the transition to mobile computing following the iPhone’s launch in 2007. More recently, Intel has lagged behind competitors in the AI chip race, where Nvidia’s GPUs have become the global standard.

The new partnership provides Intel with a critical opportunity to re-establish relevance in both AI infrastructure and consumer hardware. Analysts view the deal as a potential turning point, offering Intel a chance to modernize its operations and compete in sectors where it has been overshadowed.

AI and the Future of Personal Computing

Beyond data centers, the collaboration extends to personal computers. Nvidia and Intel plan to explore new AI-powered PC products, potentially integrating AI processing capabilities directly into consumer devices.

Such advancements could transform the everyday computing experience, enabling real-time translation, advanced creative tools, and enhanced gaming performance. By embedding AI more deeply into PCs, the companies hope to shape a new generation of consumer technology.

Industry and Market Reactions

The announcement has already attracted attention from industry watchers. Some analysts compare the move to historic collaborations that reshaped the tech sector, such as partnerships between hardware and software leaders in the early days of computing.

Others caution that success will depend on execution. Intel must prove it can adapt quickly, while Nvidia must navigate potential regulatory scrutiny and competitive pressures as it expands its influence across multiple markets.

Nonetheless, the partnership underscores a shared recognition: AI is no longer a niche technology but the backbone of future computing.

Looking Ahead

The Nvidia–Intel partnership represents both a strategic lifeline and an ambitious bet on the future of computing. For Intel, it offers renewed hope of returning to industry leadership. For Nvidia, it solidifies its role at the center of the AI revolution.

If successful, the collaboration could accelerate breakthroughs in data centers, personal computing, and beyond—reshaping how billions of people interact with technology.

Source: AP News –Nvidia to invest $5 billion in Intel; companies will work together on AI infrastructure and PCs

The post Nvidia to Invest $5 Billion in Intel, Partnering on AI Infrastructure and PC Innovation appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

Published Time: 08-20-2025, 14:30

Google has officially introduced the Pixel 10 series, along with the Pixel Watch 4 and Pixel Buds 2a, at its annual hardware event. The launch marks the 10th generation of Pixel smartphones, nearly a decade after the first model debuted, and brings meaningful hardware and software updates powered by Google’s latest AI innovations.

A Decade of Pixel Innovation

When Alphabet CEO Sundar Pichai first introduced the Pixel brand in 2016, he emphasized a shift from “mobile-first to AI-first.” That vision remains central to the new lineup, which integrates Google’s latest Tensor G5 chip, extended AI capabilities, and refined hardware across smartphones, wearables, and audio devices.

The Pixel 10 Series: Design, Hardware, and Qi2 Charging

The new lineup includes the Pixel 10, Pixel 10 Pro, Pixel 10 Pro XL, and Pixel 10 Pro Fold. While the design language remains familiar, Google has introduced Qi2 wireless charging with embedded magnets, making the devices fully compatible with Apple’s MagSafe ecosystem.

• Pixel 10, Pixel 10 Pro, and Pixel 10 Pro Fold support standard Qi2 15W charging.
• Pixel 10 Pro XL uniquely supports Qi2 25W charging, offering faster recharging than any previous Pixel.

To support this feature, Google also launched a new accessory ecosystem branded as Pixelsnap, including chargers, cases, and stands.

Pixel 10 Specs and Features

The Pixel 10 introduces a triple-camera system at an entry-level price of $799. Key features include:

• 6.3-inch OLED display with up to 120 Hz refresh rate
• 48 MP wide, 13 MP ultrawide, and 10.8 MP telephoto camera (5x optical zoom)
• Tensor G5 processor with 12 GB RAM and up to 256 GB storage
• 4,970 mAh battery with seven years of software updates

While the wide and ultrawide sensors are slightly smaller than those on the Pixel 9, the improved imaging pipeline aims to deliver sharper details, faster autofocus, and better low-light performance.

Pixel 10 Pro and Pro XL: Advanced Photography and AI

The Pixel 10 Pro ($999) and Pixel 10 Pro XL ($1,199) cater to users seeking professional-grade features. Both models feature:

• Pro Res Zoom, an AI-enhanced digital zoom capable of up to 100x magnification
• 8K video recording supported by Video Boost cloud processing
• Larger 16 GB RAM configurations and extended storage options up to 1 TB
• Brighter LTPO OLED displays with refresh rates from 1–120 Hz

The Pixel 10 Pro XL distinguishes itself with 25W Qi2 charging, capable of reaching 70 percent battery in just 30 minutes with a 45W wired charger.

Pixel 10 Pro Fold: Durability and Multitasking

The Pixel 10 Pro Fold, priced at $1,799, focuses on improved durability and productivity. It is Google’s first foldable phone rated IP68 for dust and water resistance, surpassing Samsung’s current foldables.

Highlights include:

• 6.4-inch external display and 8-inch internal display
• New gearless hinge design for improved longevity and reduced bezels
• Enhanced split-screen multitasking with app resizing and drag-and-drop support

While the Fold lacks certain Pro-exclusive features like 8K video recording and Pro Res Zoom, it emphasizes versatility and long-term usability.

AI-Powered Software Enhancements

Google continues to integrate AI deeply into its devices. Notable features across the Pixel 10 series include:

• Magic Cue, which suggests context-aware text replies in Google Messages
• Camera Coach, a real-time photography assistant
• AI-powered editing tools in Google Photos
• Live call translations across multiple languages
• A new Pixel Journal app for note-taking and daily reflections

All devices run Android with Material 3 Expressive design, introducing smoother animations, modern typography, and improved personalization.

Pixel Watch 4: Repairability and Smarter Performance

The Pixel Watch 4, launching in 41 mm ($349) and 45 mm ($399) models, emphasizes repairability with replaceable batteries and displays available through iFixit.

New features include:

• Brighter domed display and faster charging (50 percent in 15 minutes)
• Improved performance and battery efficiency
• Hands-free Gemini voice assistant activation by wrist gesture

The watch is available for preorder and officially ships on October 9.

Pixel Buds 2a: Budget-Friendly Audio with Noise Cancellation

The Pixel Buds 2a, priced at $129, are Google’s lightest earbuds to date. They feature:

• Active Noise Cancellation (ANC) and improved acoustic design
• IP54 water resistance
• Seven hours of playback with ANC, extendable to 20 hours with the charging case
• Repairable battery design in the USB-C case
• Bluetooth multipoint and Find Hub support for device tracking

Google also announced that Pixel Buds Pro 2 owners will receive a free software update in September, adding Adaptive Audio and Loud Noise Protection features.

Global Availability

All new devices are available for preorder starting today, with the Pixel 10 series and Pixel Buds 2a releasing August 28, and the Pixel Watch 4 and Buds 2a shipping October 9.

Google’s latest hardware reinforces its dual focus on AI-first experiences and sustainable, repairable designs, positioning the Pixel ecosystem as a competitive alternative to Apple and Samsung.

Source: WIRED – Everything Google Is Announcing Today at Its Pixel Hardware Event

The post Google Unveils Pixel 10 Series, Pixel Watch 4, and Pixel Buds 2a at Hardware Event appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

Published Time: August 7, 2025, 14:00 (U.S. Eastern Time)

Instagram is launching a series of updates designed to improve how users engage with friends and discover new content. The changes include a real-time location-sharing map, a Friends tab in Reels, and a new Repost feature—marking one of the app’s most social-focused updates to date.

New Location-Sharing Map Inspired by Snapchat

Instagram has introduced a location-based map feature that mirrors Snapchat’s Snap Map functionality. Known simply as Instagram Map, this tool allows users to share their last known app activity location with selected followers.

Meta, Instagram’s parent company, clarified that users have full control over who can view their location. Options include:

• Followers you follow back
• Close Friends
• A custom list
• Or no one at all

Users can toggle location sharing on or off at any time. The feature is accessible via the top of the direct messages (DM) inbox.

In addition to showing live location information, the map lets users explore geographically tagged content from their network. Stories, Reels, and feed posts that include a tagged location may appear on the map for up to 24 hours after publication.

Parental Controls for Teen Accounts

Recognizing safety concerns, Meta has included parental control tools for teen users. If a teenager begins sharing their location on the Instagram Map, their parent or guardian will be notified. Parental permissions are required for continued access to the feature, offering a balance between social engagement and online safety.

This addition reflects Meta’s ongoing efforts to strengthen protections for younger users amid growing scrutiny from regulators and child safety advocates.

Discover What Friends Are Watching: Friends Tab in Reels

Another major component of the update is the Friends tab in Instagram Reels. This new tab lets users view:

• Public content that their friends have liked or commented on
• Reels shared through group recommendation tools, such as “Blends”

According to Meta, the goal of the Friends tab is to foster deeper connections by making it easier to follow what content friends are engaging with—without necessarily needing to message or tag each other directly.

Users retain control over what is visible in this tab. You can:

• Hide your likes and comments from appearing
• Mute the activity of certain users
• Customize notifications and visibility preferences

The Friends tab, which began limited testing earlier in 2025, is now rolling out globally. You can find it by opening the Reels section and selecting the “Friends” option at the top of the screen.

Repost Function Adds a New Way to Share Public Content

Instagram has also launched a Repost feature, enabling users to share other public Reels or feed posts directly to their followers. This function simplifies how users highlight their interests and amplify creators they admire.

Key features of the Repost update include:

• A repost icon that appears on eligible Reels and posts
• An optional “thought bubble” where users can add a brief note
• Visibility of reposted content in a dedicated profile tab
• Automatic credit to the original content creator

Reposts will show up in your followers’ feeds, even if they don’t follow the original creator, offering an additional layer of content discovery.

Meta says the repost feature is part of its strategy to keep Instagram competitive with platforms like TikTok and X (formerly Twitter), where reposting or sharing content has been widely adopted.

Why These Features Matter

Instagram’s latest updates reflect Meta’s broader push to position the platform as more than just a photo and video-sharing app. With user behaviors shifting toward private messaging, location-based interactions, and short-form video, these tools are aimed at encouraging daily engagement and enhancing real-world relevance.

Moreover, borrowing familiar features from platforms like Snapchat and TikTok suggests Meta is focused on keeping Instagram fresh while capitalizing on proven engagement models.

The emphasis on user control—whether it’s choosing who can see your location or curating what friends see from your activity—demonstrates Instagram’s awareness of growing user concerns around privacy, mental health, and content moderation.

Availability and Access

All three new features—Instagram Map, the Friends tab, and the Repost tool—are rolling out now. Depending on your region and app version, you may need to update your app to access them.

To check availability:

1. Open Instagram and tap your DM inbox to find the Map.
2. Navigate to the Reels section to find the new Friends tab.
3. Use the repost icon on eligible public Reels and feed posts.

Meta has not confirmed when these features will be universally available, but a global rollout is expected within the coming weeks.

Final Thoughts

With the launch of location sharing, deeper content discovery, and simplified reposting, Instagram continues to evolve as a hybrid between a messaging app, a content network, and a social discovery platform. These changes represent Meta’s ambition to make Instagram more relevant to users seeking connection and creativity in a saturated social media landscape.

As always, users are encouraged to review their privacy settings regularly and explore the new tools responsibly to maintain control over their digital footprint.

Source: ZDNET – Instagram adds a Snapchat-style location map – how it works

The post Instagram Introduces Map and Repost Features in Major Update appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

July 28, 2025 – 14:00 ET

Intel’s next-generation desktop processors, codenamed Nova Lake, could bring major performance improvements—particularly in gaming—thanks to a newly leaked specification highlighting a massive last-level cache design called “BLLC.” These chips are positioned to directly rival AMD’s successful X3D processors, known for their enhanced cache configurations that boost gaming and productivity workloads.

Intel’s Nova Lake Strategy: Bigger Cache and More Cores

According to leaked details shared by hardware leaker @OneRaichu, Intel’s Nova Lake lineup will include CPUs equipped with eight performance (P) cores and sixteen efficient (E) cores, paired with a significantly expanded last-level cache known as BLLC (Big Last Level Cache). This configuration is designed to rival AMD’s Ryzen 7000 and upcoming Zen 6 X3D chips, which have dominated cache-based performance gains in gaming scenarios.

Intel also plans a high-end Nova Lake variant with a doubled core count—sixteen P-cores and thirty-two E-cores. However, this model reportedly will not include the BLLC feature. Instead, the BLLC will be reserved for select high-performance gaming CPUs, similar to how AMD segments its lineup into X3D and non-X3D chips.

Two-Tier Cache Configurations Target Different Segments

A separate leak from @Haze2K1 suggests that Intel will launch at least two BLLC-equipped CPUs. Both models are expected to feature eight P-cores and four low-power efficient (LPE) cores, paired with either twelve or sixteen E-cores, depending on the SKU. These CPUs will reportedly fall under the Intel Core Ultra 5 and Ultra 7 branding and are targeted squarely at gaming and high-performance desktop users.

Both CPUs are rumored to carry a 125W TDP, which aligns them with today’s high-performance gaming processors. These chips are expected to serve as Intel’s response to AMD’s Ryzen 7 7800X3D and future Zen 6-based chips that leverage additional cache for gaming advantages.

BLLC Cache: Intel’s Answer to AMD’s X3D

The standout feature in these leaks is the BLLC technology, which is expected to boost the L3 cache from the standard 36MB seen in recent Intel chips to as much as 144MB in Nova Lake CPUs. This would exceed the 96MB L3 cache available in AMD’s current top-end gaming chip, the Ryzen 7 9800X3D.

To add context, AMD is also reportedly planning to increase its L3 cache in Zen 6 to 144MB for its 12-core X3D gaming chips, matching Intel’s leaked Nova Lake figures. There’s also speculation that AMD is exploring a two-high 3D cache stack, potentially pushing L3 cache sizes up to 240MB per chiplet—a move that would redefine cache-heavy gaming and workstation performance.

Intel’s strategy appears to be a direct counter to AMD’s X3D innovations. By integrating large L3 caches into select Nova Lake CPUs, Intel aims to recapture the gaming performance lead, which it ceded in recent years to AMD’s cache-boosted models.

Timeline and Product Differentiation

Intel’s Nova Lake CPUs with standard core counts and BLLC are expected to launch first, with the higher-core-count model (16P + 32E) arriving roughly one quarter later, according to @OneRaichu’s leak. This staggered release is likely a strategic move to let Intel build market momentum before introducing its more workstation-oriented chips.

It’s worth noting that only specific SKUs in the Nova Lake family will include the BLLC technology—an approach similar to AMD’s segmentation of X3D versus non-X3D chips. This helps Intel serve both gaming enthusiasts and productivity-focused professionals without overlapping performance tiers.

AMD Zen 6 Competition Will Be Fierce

AMD is not standing still. Alongside the aforementioned cache increases, Zen 6 CPUs are expected to deliver 50% more cores per compute die (CCD), improving multithreaded performance and overall throughput. These gains are expected to arrive in late 2025 or early 2026, putting them on a collision course with Intel’s Nova Lake chips.

If both companies deliver on these promises, 2026 is shaping up to be one of the most competitive years in recent CPU history—not just in gaming but also in productivity and creative workloads.

Final Thoughts: A New Chapter in the CPU Wars

Intel’s BLLC-equipped Nova Lake CPUs suggest a serious effort to reclaim the performance crown from AMD. With massive L3 caches and enhanced core configurations, Nova Lake could mark a turning point after several years of AMD dominance in the gaming sector. However, as with all leaks, these specifications remain unconfirmed and should be treated cautiously until officially revealed by Intel.

Still, the direction is clear: larger caches, more cores, and smarter segmentation are becoming the new battleground for desktop CPUs. Enthusiasts, gamers, and professionals alike should keep a close eye on developments from both Intel and AMD in the coming months.

Source: Overclock3d – Intel Nova Lake CPU Specs Leak – HUGE “BLLC” Cache to Rival AMD X3D

The post Intel Nova Lake CPU Leak Reveals Massive Cache to Challenge AMD X3D appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

BANGKOK — Nvidia CEO Jensen Huang announced Monday that the U.S. government has granted the company permission to resume shipments of its advanced H20 artificial intelligence chips to China, marking a significant shift in American tech export policy.

The decision comes after Huang met with President Donald Trump and other U.S. officials in recent weeks. Nvidia had previously faced restrictions under White House export controls aimed at limiting China’s access to cutting-edge AI hardware.

U.S. Greenlights AI Chip Licensing

In a blog post and televised interview on China’s CGTN, Huang confirmed that Washington will now allow Nvidia to file export licenses and begin deliveries of its H20 chips to Chinese customers.

“The U.S. government has assured Nvidia that licenses will be granted, and Nvidia hopes to start deliveries soon,” the company stated.

Speaking to reporters in Beijing, Huang emphasized the importance of the Chinese market:

“Half of the world’s AI researchers are in China. It’s so innovative and dynamic here… It’s really important that American companies can compete and serve the market in China.”

Strategic Visit to Beijing

Huang is currently in China to attend the China International Supply Chain Expo in Beijing. He met with Ren Hongbin, chair of the China Council for Promotion of International Trade, and other Chinese officials.

Nvidia is among the event’s major exhibitors, underscoring the company’s continued efforts to strengthen ties in one of the world’s largest tech markets.

AI, Trade, and Tech Tensions

Nvidia’s rapid rise—recently becoming the first company to surpass a $4 trillion market value—has been driven by explosive global demand for AI computing power. But U.S.-China tensions over advanced technology exports have created headwinds for the chipmaker.

The Biden administration, prior to Trump’s return to office, had imposed stricter export rules on AI chips in early 2024, citing national security concerns. The restrictions targeted Nvidia’s H20 and AMD’s MI308 chips, aiming to prevent potential military applications in China.

In response, Nvidia warned that the export curbs could cost the company $5.5 billion and damage U.S. competitiveness in AI. Industry leaders urged the Trump administration to reconsider, arguing that excessive limits would not only reduce American influence but potentially boost Chinese-developed alternatives.

Markets Respond to Policy Shift

Following Huang’s announcement, Nvidia’s U.S.-listed shares surged nearly 5% in premarket trading, reflecting investor optimism that the decision could help the company regain lost sales in the vital Chinese market.

Looking Ahead

While the approval marks a major win for Nvidia, the broader issue of balancing national security with economic opportunity in U.S.-China tech relations remains unresolved. Analysts expect the Trump administration to face ongoing pressure from both industry and national security officials as artificial intelligence continues to reshape global power dynamics.

Source: AP News – After meeting with Trump, Nvidia CEO says the sale of AI chip is back on in China

The post Nvidia Gets U.S. Green Light to Resume AI Chip Sales to China After Trump Meeting appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

SEOUL, South Korea — Samsung has launched its latest line of foldable smartphones, doubling down on a product category it pioneered and that remains one of the few areas where Apple has yet to compete.

On Wednesday, Samsung introduced three new devices: the $2,000 Galaxy Z Fold 7, the $1,100 Galaxy Z Flip 7, and the more affordable $900 Galaxy Z Flip 7 FE. Preorders began July 9, with official sales set for July 25.

The company hopes its upgraded lineup — featuring slimmer builds, larger screens, and improved AI integration — will help foldables transition from niche to mainstream.

Samsung Sharpens Its Edge in the Premium Market

While Apple dominates global premium smartphone sales, Samsung is positioning its foldable lineup as the cutting-edge alternative. Despite persistent rumors of a foldable iPhone, Apple has not confirmed plans to enter the space. Analysts expect a potential Apple foldable no earlier than 2026.

“Now, with the launch of the Fold 7 and Flip 7, we believe we’re nearing the tipping point of going mainstream,” said Won-joon Choi, COO of Samsung’s mobile experience division, in an interview with CNN.

Samsung has led the foldable market since launching its first device in 2019. The category, however, still makes up less than 2% of the global smartphone market, according to IDC and Counterpoint Research. Even so, total foldable shipments are projected to reach 45.7 million units by 2028, far behind the 1.2 billion smartphones shipped in 2024.

What’s New in the Fold 7 and Flip 7

Samsung’s new foldables aim to reduce bulk while enhancing usability:

• Galaxy Z Fold 7: Now lighter than the Galaxy S25 Ultra, it features an expanded 8-inch internal screen, up from 7.6 inches in the previous model.
• Galaxy Z Flip 7: Boasts a larger 4.1-inch cover screen and an improved 6.9-inch internal display, offering a more traditional smartphone feel when open.
• Galaxy Z Flip 7 FE: A budget-friendly model with a similar design to older flip phones and an older processor.

For the first time, Samsung is using two different processors across the lineup — a Qualcomm chip for the Fold 7 and an Exynos chip for the Flip 7 — due to supply chain considerations.

Despite early expectations that foldables would decrease in cost over time, Samsung’s new Fold 7 is actually $100 more expensive than last year’s version. The company attributes the hike to upgraded hardware and design refinements.

Foldables May Be Small in Volume — But Big in Profit

According to IDC analyst Francisco Jeronimo, Samsung and its rivals are realizing that they don’t need to sell massive volumes of foldables to generate strong revenue.

“They are not really pushing prices down,” Jeronimo said. “They realized that despite shipping small volumes, they are making decent money out of it.”

Foldables are also attracting users away from Apple. In Q1 2025, 8% of U.S. foldable buyers switched from iPhones, according to Consumer Intelligence Research Partners.

Samsung’s internal data backs this up. Choi noted that foldables have a higher brand-switching rate than traditional smartphones, suggesting their uniqueness is drawing users from both iOS and Android ecosystems.

Competition Heats Up — Especially in China

Samsung’s dominance is increasingly being challenged by Chinese brands like Huawei, Vivo, and Honor, which have carved out major market share in China — the world’s largest foldable market.

Just days before Samsung’s launch, Honor revealed its own ultra-slim foldable, the Magic V5. Huawei has already outpaced Samsung in innovation this year, releasing a dual-folding phone with a screen nearly the size of an iPad.

Samsung has shown prototypes of similar concepts at trade shows but hasn’t brought them to market — yet.

“We have a new style of device that can be brought to market in the near future,” Choi teased, without offering specifics.

Betting on AI to Shape the Smartphone’s Next Phase

Samsung is also integrating AI to boost the utility of its foldables. The company has worked with Google to optimize Gemini, Google’s AI assistant, for foldable screens. For the first time, Gemini Live is available on the Flip 7’s cover display, allowing for hands-free, conversational interactions.

On the Fold 7, Gemini can multitask across multiple windows — a feature Samsung believes enhances productivity and entertainment on the device’s tablet-like display.

Samsung is also exploring collaborations with other AI partners, though Choi declined to name them. Bloomberg recently reported the company is nearing a deal with AI search engine Perplexity.

Choi envisions a future where AI agents replace traditional apps, handling tasks like movie recommendations, recipe sharing, or vacation planning.

“I don’t think it’s 10 years away,” he said. “But it’s not six months either. Somewhere in between — and it’s going to happen.”

Final Thoughts

Samsung’s Fold 7 and Flip 7 lineup underscores the company’s commitment to driving innovation in a market dominated by familiar designs. With Apple still absent from the foldable space, Samsung is using this window to solidify its lead — even as rivals close in and consumer expectations shift toward smarter, more versatile devices.

As the company doubles down on foldables and AI, the next evolution of the smartphone may be just a few folds away.

Source: CNN – Samsung’s bet on the future of smartphones is something Apple doesn’t have an answer to yet

The post Samsung Unveils Galaxy Z Fold 7 and Flip 7, Doubling Down on Foldable Future appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

In a landmark move that’s shaking up the global tech landscape, Taiwan Semiconductor Manufacturing Company (TSMC) has announced a staggering $100 billion investment in the US — the largest foreign investment in American history. This massive commitment includes building two state-of-the-art advanced packaging facilities in Arizona and has sent ripples of excitement and concern from Silicon Valley to Taipei.

But why is this investment such a big deal? The answer lies in a little-known but absolutely critical chip technology called advanced packaging — a technology that’s becoming a linchpin in the battle for AI supremacy between the US and China.

What Is Advanced Packaging — And Why Should You Care?

At a recent Taipei tech event, Computex, Nvidia CEO Jensen Huang summed it up perfectly: “The importance of advanced packaging for AI is very high… no one has pushed advanced packaging harder than me.” So, what exactly is advanced packaging?

Simply put, packaging in chipmaking means protecting a chip inside a casing and attaching it to a circuit board inside your device. But advanced packaging takes this to the next level. It’s a suite of high-tech techniques that let multiple chips — like CPUs, GPUs, or high-bandwidth memory — sit much closer together. The result? Chips talk to each other faster, work more efficiently, and consume less power.

Imagine a company where different departments need to collaborate closely. The closer those departments are physically, the quicker and smoother the teamwork. That’s advanced packaging for chips.

The Secret Sauce Behind AI Powerhouses

This technology isn’t just a minor upgrade — it’s a game changer. The AI models powering tools like ChatGPT need insanely complex calculations done in the blink of an eye. Advanced packaging makes this possible by ensuring AI chips run at peak speed without hiccups.

TSMC’s own flagship advanced packaging tech, CoWoS (Chips-on-Wafer-on-Substrate), has become almost legendary, especially since the AI boom kicked off. It’s so well-known in Taiwan that even casual tech fans recognize the term.

Nvidia, AMD, and other giants rely heavily on CoWoS for their AI processors. In fact, you could call CoWoS “the Nvidia packaging process,” says Dan Nystedt from investment firm TrioOrient. Demand for this tech has exploded, and TSMC is racing to expand production.

The US Stakes Its Claim in the AI Chip Battle

TSMC’s $100 billion Arizona investment means the US is getting a “one-stop shop” for both advanced chip manufacturing and packaging. This move is crucial — it strengthens America’s AI chip supply chain and boosts competitiveness for top tech players like Apple, Nvidia, AMD, Qualcomm, and Broadcom.

Why is this important? Because, until now, advanced packaging tech like CoWoS has been almost exclusively made in Taiwan. Having facilities in Arizona reduces risks tied to supply chain disruptions — no longer are “all eggs in one basket.”

A Technology with a 15-Year Journey

Though CoWoS is making headlines now, it’s actually been around for over 15 years. It was developed under the leadership of Chiang Shang-yi, a TSMC engineer who faced skepticism and pressure when he first pitched the idea back in 2009.

Initially, few companies adopted CoWoS due to high costs, and Chiang was often the lone advocate. But the recent AI surge has turned CoWoS into a star technology, far exceeding early expectations.

Who’s Playing in the Advanced Packaging Arena?

TSMC isn’t alone in this race. Other chip manufacturing giants like South Korea’s Samsung and America’s Intel, alongside specialized outsourced semiconductor assembly and test (OSAT) firms — including China’s JCET, America’s Amkor, and Taiwan’s ASE Group and SPIL — are all key players developing advanced packaging technologies.

The Bigger Picture: US-China Tech Rivalry

The US and China’s tussle over semiconductor tech is complex. Though they recently agreed to a 90-day tariff truce, tensions simmer due to ongoing US restrictions on chip exports to China. Advanced packaging tech sits at the heart of this struggle because it’s vital for AI chip performance — a strategic resource in the global AI arms race.

Bottom Line

Advanced packaging might sound like a technical niche, but it’s really a critical piece in the puzzle of AI innovation and global tech power. TSMC’s historic investment signals how important it is, not just to chipmakers, but to the future of AI and the broader US-China competition for technological dominance.

The chips may be small, but their impact is massive — and advanced packaging is the glue holding it all together.

Source: CNN – Why this key chip technology is crucial to the AI race between the US and China

The post Why Advanced Chip Packaging Is a Game Changer in the US-China AI Race appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.

Taipei, Taiwan — Nvidia CEO Jensen Huang has sharply criticized U.S. restrictions on exporting advanced computing chips to China, calling the policy a “failure” that is hurting American businesses more than its intended targets.

Speaking at the annual Computex tech conference in Taipei, Huang didn’t mince words when describing the fallout from U.S. export controls. “The fundamental assumptions that led to the AI diffusion rule in the beginning have been proven to be fundamentally flawed,” Huang told reporters.

Nvidia’s Market Share in China Cut in Half

Huang pointed to the dramatic drop in Nvidia’s market share in China as a direct consequence of these restrictions. Once commanding 95% of the Chinese market for advanced chips, Nvidia now holds just 50%. The CEO said that rather than slowing China’s tech ambitions, U.S. policies have fueled a push for self-reliance, with Chinese companies ramping up investment in domestic semiconductor development.

U.S. Policy Shift Sparks Debate

The criticism comes just days after the Trump administration announced it would scrap some of the Biden-era rules that had imposed blanket bans on exports to China. While that move is expected to open the door for new AI deals with countries like Saudi Arabia—deals Nvidia is already eyeing—it also comes with tighter restrictions elsewhere.

Under the revised strategy, the U.S. will still restrict advanced technology exports to dozens of entities, most of them based in China. This includes new licensing rules for specific Nvidia chips and warnings to U.S. firms about using Chinese-made components from companies like Huawei.

Tech vs. National Security: A Growing Divide

Huang’s remarks tap into a broader debate in Washington: how to balance national security with economic competitiveness. Both the Trump and Biden administrations have cited military risks in justifying tech export controls. However, many in the business community argue these rules often end up isolating U.S. companies and encouraging global buyers to look elsewhere.

While former President Trump has championed aggressive trade measures, including sweeping tariffs, he has shown more flexibility with the tech industry—particularly as it played a key role in backing his reelection campaign.

During a recent Middle East tour, Trump touted the loosening of chip export restrictions as a win for American innovation, positioning companies like Nvidia to strike lucrative international deals.

Beijing Fires Back

The U.S. moves have not gone unnoticed in China. In response to the latest crackdown, Beijing accused Washington of violating the trade framework both sides had tentatively agreed upon during negotiations in Switzerland earlier this month.

Chinese officials argue that America’s shifting rules are undermining trust and further destabilizing global tech supply chains.

Bottom Line:

Jensen Huang’s blunt assessment underscores growing frustration in Silicon Valley over how U.S. chip policies are being handled. As global tech competition heats up, the battle over who controls the future of semiconductors is far from over—and American firms may be caught in the middle.

Source: BBC – Nvidia boss calls US chip policy a ‘failure’

The post Jensen Huang: U.S. Policy Is Hurting American Tech, Not China appeared first on Journos News - Breaking News, World News, Top Stories, Todays Headlines and Flash Reports.